SEC Form D filing

HIG Lending Opportunities LLC

Fintech · Series A · Regulation D 506(c) · MI · Filed May 11, 2026

Offering amount: $10.0M
Exemption: Reg D 506(c)
Issuer state: MI
Filing date: May 11, 2026
Signature date: May 11, 2026
CIK: 0002068060

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Sector: Fintech Month: May 2026 Stage and month: Series A

Summary

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HIG Lending (fintech lending platform); $10M series-a.

Generated automatically by a language model from the public SEC filing; may contain errors. Verify against the source document on EDGAR. FormDFlow surfaces public-disclosure data from SEC EDGAR. Nothing here is investment advice.

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FormDFlow surfaces public-disclosure data from SEC EDGAR. Nothing here is investment advice.